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INTEGRATED CIRCUITS
DATA SHEET
PCA82C250 CAN controller interface
Product specification Supersedes data of 1997 Oct 21 File under Integrated Circuits, IC18 2000 Jan 13
Philips Semiconductors
Product specification
CAN controller interface
FEATURES * Fully compatible with the "ISO 11898" standard * High speed (up to 1 Mbaud) * Bus lines protected against transients in an automotive environment * Slope control to reduce Radio Frequency Interference (RFI) * Differential receiver with wide common-mode range for high immunity against ElectroMagnetic Interference (EMI) * Thermally protected * Short-circuit proof to battery and ground * Low-current standby mode * An unpowered node does not disturb the bus lines * At least 110 nodes can be connected. QUICK REFERENCE DATA SYMBOL VCC ICC 1/tbit VCAN Vdiff tPD Tamb PARAMETER supply voltage supply current maximum transmission speed CANH, CANL input/output voltage differential bus voltage propagation delay ambient temperature high-speed mode standby mode non-return-to-zero CONDITIONS - 1 -8 1.5 - -40 MIN. 4.5 GENERAL DESCRIPTION APPLICATIONS
PCA82C250
* High-speed applications (up to 1 Mbaud) in cars.
The PCA82C250 is the interface between the CAN protocol controller and the physical bus. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller.
MAX. 5.5 170 - +18 3.0 50 +125 V
UNIT A Mbaud V V ns C
ORDERING INFORMATION TYPE NUMBER PCA82C250 PCA82C250T PCA82C250U PACKAGE NAME DIP8 SO8 - DESCRIPTION plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 8 leads; body width 3.9 mm bare die; 2790 x 1780 x 380 m CODE SOT97-1 SOT96-1 -
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Philips Semiconductors
Product specification
CAN controller interface
BLOCK DIAGRAM
PCA82C250
handbook, full pagewidth
VCC 3
TXD
1
PROTECTION
Rs
8
SLOPE/ STANDBY
DRIVER HS 7 CANH
RXD
4
RECEIVER 6 CANL
Vref
5
REFERENCE VOLTAGE
PCA82C250
2 GND
MKA669
Fig.1 Block diagram.
PINNING SYMBOL TXD GND VCC RXD Vref CANL CANH Rs PIN 1 2 3 4 5 6 7 8 ground supply voltage receive data output reference voltage output LOW-level CAN voltage input/output HIGH-level CAN voltage input/output slope resistor input DESCRIPTION transmit data input
handbook, halfpage
TXD 1 GND 2
8 Rs 7 CANH CANL Vref
PCA82C250
VCC RXD 3 4
MKA670
6 5
Fig.2 Pin configuration.
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Philips Semiconductors
Product specification
CAN controller interface
FUNCTIONAL DESCRIPTION The PCA82C250 is the interface between the CAN protocol controller and the physical bus. It is primarily intended for high-speed applications (up to 1 Mbaud) in cars. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. It is fully compatible with the "ISO 11898" standard. A current limiting circuit protects the transmitter output stage against short-circuit to positive and negative battery voltage. Although the power dissipation is increased during this fault condition, this feature will prevent destruction of the transmitter output stage. If the junction temperature exceeds a value of approximately 160 C, the limiting current of both transmitter outputs is decreased. Because the transmitter is responsible for the major part of the power dissipation, this will result in a reduced power dissipation and hence a lower chip temperature. All other parts of the IC will remain in operation. The thermal protection is particularly needed when a bus line is short-circuited. The CANH and CANL lines are also protected against electrical transients which may occur in an automotive environment. Table 1 Truth table of the CAN transceiver SUPPLY 4.5 to 5.5 V 4.5 to 5.5 V <2 V (not powered) 2 V < VCC < 4.5 V 2 V < VCC < 4.5 V Note 1. X = don't care. Table 2 Pin Rs summary CONDITION FORCED AT PIN Rs VRs > 0.75VCC -10 A < IRs < -200 A VRs < 0.3VCC MODE standby slope control high-speed TXD 0 1 (or floating) X(1) >0.75VCC X(1) CANH HIGH floating floating floating floating if VRs > 0.75VCC CANL LOW floating floating floating floating if VRs > 0.75VCC
PCA82C250
Pin 8 (Rs) allows three different modes of operation to be selected: high-speed, slope control or standby. For high-speed operation, the transmitter output transistors are simply switched on and off as fast as possible. In this mode, no measures are taken to limit the rise and fall slope. Use of a shielded cable is recommended to avoid RFI problems. The high-speed mode is selected by connecting pin 8 to ground. For lower speeds or shorter bus length, an unshielded twisted pair or a parallel pair of wires can be used for the bus. To reduce RFI, the rise and fall slope should be limited. The rise and fall slope can be programmed with a resistor connected from pin 8 to ground. The slope is proportional to the current output at pin 8. If a HIGH level is applied to pin 8, the circuit enters a low current standby mode. In this mode, the transmitter is switched off and the receiver is switched to a low current. If dominant bits are detected (differential bus voltage >0.9 V), RXD will be switched to a LOW level. The microcontroller should react to this condition by switching the transceiver back to normal operation (via pin 8). Because the receiver is slow in standby mode, the first message will be lost.
BUS STATE dominant recessive recessive recessive recessive
RXD 0 1 X(1) X(1) X(1)
RESULTING VOLTAGE OR CURRENT AT PIN Rs IRs < 10 A 0.4VCC < VRs < 0.6VCC IRs < -500 A
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Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to pin 2; positive input current. SYMBOL VCC Vn V6, 7 Vtrt Tstg Tamb Tvj Vesd PARAMETER supply voltage DC voltage at pins 1, 4, 5 and 8 DC voltage at pins 6 and 7 transient voltage at pins 6 and 7 storage temperature ambient temperature virtual junction temperature electrostatic discharge voltage note 1 note 2 note 3 Notes 1. In accordance with "IEC 60747-1". An alternative definition of virtual junction temperature is: Tvj = Tamb + Pd x Rth(vj-a), where Rth(j-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (Pd) and ambient temperature (Tamb). 2. Classification A: human body model; C = 100 pF; R = 1500 ; V = 2000 V. 3. Classification B: machine model; C = 200 pF; R = 25 ; V = 200 V. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PCA82C250 PCA82C250T QUALITY SPECIFICATION According to "SNW-FQ-611 part E". PARAMETER thermal resistance from junction to ambient CONDITIONS in free air 100 160 K/W K/W VALUE UNIT 0 V < VCC < 5.5 V; no time limit see Fig.8 CONDITIONS MIN. -0.3 -0.3 -8.0 -150 -55 -40 -40 -2000 -200 MAX. +9.0 +18.0 +100 +150 +125 +150 +2000 +200 V V V C C C V V VCC + 0.3 V UNIT
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Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
CHARACTERISTICS VCC = 4.5 to 5.5 V; Tamb = -40 to +125 C; RL = 60 ; I8 > -10 A; unless otherwise specified; all voltages referenced to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only 100% tested at +25 C. SYMBOL Supply I3 supply current dominant; V1 = 1 V recessive; V1 = 4 V; R8 = 47 k recessive; V1 = 4 V; V8 = 1 V standby; Tamb < 90 C; note 1 DC bus transmitter VIH VIL IIH IIL V6,7 ILO V7 V6 V6, 7 HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current recessive bus voltage off-state output leakage current CANH output voltage CANL output voltage difference between output voltage at pins 6 and 7 output recessive output dominant V1 = 4 V V1 = 1 V V1 = 4 V; no load -2 V < (V6,V7) < 7 V -5 V < (V6,V7) < 18 V V1 = 1 V V1 = 1 V V1 = 1 V V1 = 1 V; RL = 45 ; VCC 4.9 V V1 = 4 V; no load Isc7 Isc6 short-circuit CANH current short-circuit CANL current V7 = -5 V; VCC 5 V V7 = -5 V; VCC = 5.5 V V6 = 18 V 0.7VCC -0.3 -200 -100 2.0 -2 -5 2.75 0.5 1.5 1.5 -500 - - - -1.0 -7 V < (V6, V7) < 12 V; not standby mode -7 V < (V6, V7) < 12 V; not standby mode see Fig.5 I4 = -100 A -1.0 0.9 1.0 - 0.8VCC 0 0 5 6 - - - - - - - - - - - - - - - - - - - 150 - - - - VCC + 0.3 V 0.3VCC +30 -600 3.0 +1 +12 4.5 2.25 3.0 - +50 -105 -120 160 V A A V mA mA V V V V mV mA mA mA - - - - - - - 100 70 14 18 170 mA mA mA A PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
DC bus receiver: V1 = 4 V; pins 6 and 7 externally driven; -2 V < (V6, V7) < 7 V; unless otherwise specified Vdiff(r) differential input voltage (recessive) differential input voltage (dominant) differential input hysteresis HIGH-level output voltage (pin 4) +0.5 +0.4 5.0 5.0 - VCC 0.2VCC 1.5 25 V V V V mV V V V k
Vdiff(d)
Vdiff(hys) VOH VOL Ri
LOW-level output voltage (pin 4) I4 = 1 mA I4 = 10 mA CANH, CANL input resistance
2000 Jan 13
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
SYMBOL Rdiff Ci Cdiff Vref
PARAMETER differential input resistance CANH, CANL input capacitance differential input capacitance
CONDITIONS 20 - - V8 = 1 V; -50 A < I5 < 50 A V8 = 4 V; -5 A < I5 < 5 A
MIN. - - - - -
TYP.
MAX. 100 20 10
UNIT k pF pF
Reference output reference output voltage 0.45VCC 0.4VCC 0.55VCC 0.6VCC V V
Timing (see Figs 4, 6 and 7) tbit tonTXD toffTXD tonRXD toffRXD minimum bit time delay TXD to bus active delay TXD to bus inactive delay TXD to receiver active delay TXD to receiver inactive V8 = 1 V V8 = 1 V V8 = 1 V V8 = 1 V V8 = 1 V; VCC < 5.1 V; Tamb < +85 C V8 = 1 V; VCC < 5.1 V; Tamb < +125 C V8 = 1 V; VCC < 5.5 V; Tamb < +85 C V8 = 1 V; VCC < 5.5 V; Tamb < +125 C tonRXD toffRXD SR tWAKE tdRXDL V8 I8 Vstb Islope Vslope Note 1. I1 = I4 = I5 = 0 mA; 0 V < V6 < VCC; 0 V < V7 < VCC; V8 = VCC. delay TXD to receiver active delay TXD to receiver inactive differential output voltage slew rate wake-up time from standby (via pin 8) bus dominant to RXD LOW V8 = 4 V; standby mode R8 = 47 k R8 = 24 k R8 = 47 k R8 = 24 k R8 = 47 k - - - - - - - - - - - - - - - - V8 = 0 V - 0.75VCC -10 0.4VCC - - 40 55 82 82 90 90 390 260 260 210 14 - - - - - - - 1 50 80 120 150 170 170 190 520 320 450 320 - 20 3 s ns ns ns ns ns ns ns ns ns ns ns V/s s s V A V A V
Standby/slope control (pin 8) input voltage for high-speed input current for high-speed input voltage for standby mode slope control mode current slope control mode voltage 0.3VCC -500 - -200 0.6VCC
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Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
handbook, halfpage
+5 V 100 pF
VCC TXD CANH
PCA82C250
Vref CANL GND 30 pF Rs Rext
MKA671
62
100 pF
RXD
Fig.3 Test circuit for dynamic characteristics.
handbook, full pagewidth
VCC VTXD 0V
0.9 V Vdiff 0.5 V
VRXD 0.3VCC tonTXD tonRXD toffTXD toffRXD
0.7VCC
MKA672
Fig.4 Timing diagram for dynamic characteristics.
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Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
handbook, full pagewidth
VRXD HIGH
LOW hysteresis
0.5 V
0.9 V
Vdiff
MKA673
Fig.5 Hysteresis.
handbook, full pagewidth
VRs
VCC
0V
VRXD
tWAKE
MKA674
V1 = 1 V.
Fig.6 Timing diagram for wake-up from standby.
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Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
handbook, full pagewidth
1.5 V Vdiff 0V
VRXD
tdRXDL
MKA675
V1 = 4 V; V8 = 4 V.
Fig.7 Timing diagram for bus dominant to RXD LOW.
handbook, full pagewidth
+5 V VCC TXD CANH
1 nF
PCA82C250
RXD 62 1 nF Vref GND Rs Rext CANL
SCHAFFNER GENERATOR
MKA676
The waveforms of the applied transients shall be in accordance with "ISO 7637 part 1", test pulses 1, 2, 3a and 3b.
Fig.8 Test circuit for automotive transients.
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Philips Semiconductors
Product specification
CAN controller interface
APPLICATION INFORMATION
PCA82C250
handbook, halfpage
P8xC592/P8xCE598 CAN-CONTROLLER
CTX0 CRX0 CRX1 PX,Y
Rext +5 V TXD RXD Vref Rs VCC
PCA82C250T CAN-TRANSCEIVER
GND CANH CANL
100 nF
124
CAN BUS LINE
124
MKA677
Fig.9 Application of the CAN transceiver.
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Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
handbook, full pagewidth
SJA1000 CAN-CONTROLLER
TX0 TX1 +5 V VDD 390 RX0 6.8 k 390 RX1 3.6 k 100 nF
6N137 0V 6N137
VSS
390 +5 V TXD
100 nF
+5 V
390
RXD
Vref
Rs VCC
+5 V
PCA82C250 CAN-TRANSCEIVER
GND CANH CANL
100 nF
Rext
124
CAN BUS LINE
124
MKA678
Fig.10 Application with galvanic isolation.
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Philips Semiconductors
Product specification
CAN controller interface
INTERNAL PIN CONFIGURATION
PCA82C250
handbook, full pagewidth
VCC 3
TXD
1
Rs
8
RXD
4
7
CANH CANL
PCA82C250
Vref 5 6
2 GND
MKA679
Fig.11 Internal pin configuration.
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Philips Semiconductors
Product specification
CAN controller interface
BONDING PAD LOCATIONS
PCA82C250
COORDINATES(1) SYMBOL TXD GND VCC RXD Vref CANL CANH Rs Note 1. All coordinates (m) represent the position of the centre of each pad with respect to the bottom left-hand corner of the die (x/y = 0). PAD x 1 2 3 4 5 6 7 8 196 1280 1767 2588 2594 1689 948 196 y 135 135 135 135 1640 1640 1640 1640
CANH
8
7
6
1.78 mm
PCA82C250U
1 TXD x 0
2 GND
3 VCC
0 y
RXD
Vref 5 4
handbook, full pagewidth
CANL
Rs
2.79 mm
MGL945
Fig.12 Bonding pad locations.
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Philips Semiconductors
Product specification
CAN controller interface
PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil)
PCA82C250
SOT97-1
D seating plane
ME
A2
A
L
A1
c Z e b1 wM (e 1) b2 5 MH
b 8
pin 1 index E
1
4
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001 EIAJ SC-504-8 EUROPEAN PROJECTION
ISSUE DATE 95-02-04 99-12-27
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Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024
0.028 0.004 0.012
8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
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Philips Semiconductors
Product specification
CAN controller interface
SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
PCA82C250
Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 17
2000 Jan 13
Philips Semiconductors
Product specification
CAN controller interface
Suitability of IC packages for wave, reflow and dipping soldering methods
PCA82C250
SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. suitable(2) not suitable not suitable(3) suitable not recommended(4)(5) not recommended(6) REFLOW(1) DIPPING - suitable suitable suitable suitable suitable suitable - - - - -
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Philips Semiconductors
Product specification
CAN controller interface
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
PCA82C250
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. BARE DIE DISCLAIMER All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used.
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Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 69
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
285002/05/pp20
Date of release: 2000
Jan 13
Document order number:
9397 750 06609

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